Paras Semiconductors Partners BroadPak For ₹6,200 Crore Semiconductor Facility

Paras Semiconductors, a division of Paras Defence, has partnered with US-based BroadPak Corporation to set up a ₹6,200 crore advanced semiconductor packaging facility in Madhya Pradesh. Construction is expected to begin in Q1 2027, with commercial production targeted for Q4 2028.

The facility will initially process 10,000 wafers monthly and serve AI, data centre, automotive and high-performance computing markets. The project is expected to create 2,500 direct and 10,000 indirect jobs once fully scaled.

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